Wideband multiplexer for radio-frequency applications

ABSTRACT

Wideband multiplexer for radio-frequency (RF) applications. In some embodiments, a multiplexer may include a common path configured to receive a plurality of RF signals. The multiplexer may further include a first path having an output coupled to the common path and configured to provide a band-pass response for a frequency band BX. The multiplexer may further include a second path having an output coupled to the common path such that RF signals in the first and second paths are combined and routed through the common path. The second path may be configured to provide a band-stop response for the frequency band BX such that the common path includes a wideband response that includes the frequency band BX and one or more other frequency bands.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Application No.62/183,608 filed Jun. 23, 2015, entitled “WIDEBAND MULTIPLEXER FORRADIO-FREQUENCY APPLICATIONS,” the disclosure of which is herebyexpressly incorporated by reference herein in its respective entirety.

BACKGROUND

Field

The present disclosure relates to multiplexers (such as diplexers andtriplexers) that may be capable of providing a wideband capability.

Description of the Related Art

Many designs for wireless devices such as smartphones and tablets desirelower cost and smaller size, while simultaneously increasing complexityand performance requirements. Radio-frequency (RF) front-end modules(FEMs) provide a platform where at least some of such designs can beimplemented. For example, functionalities associated with switching,filtering, and power amplifiers (PAs) can be implemented in a FEM.

SUMMARY

In some implementations, the present disclosure relates to a multiplexerfor processing of radio-frequency (RF) signals. The multiplexer includesa common path configured to receive a plurality of RF signals. Themultiplexer also includes a first path having an output coupled to thecommon path and configured to provide a band-pass response for afrequency band BX. The multiplexer further includes a second path havingan output coupled to the common path such that RF signals in the firstand second paths are combined and routed through the common path, thesecond path configured to provide a band-stop response for the frequencyband BX such that the common path includes a wideband response thatincludes the frequency band BX and one or more other frequency bands.

In some embodiments, the first path includes a band-pass filterconfigured to provide the band-pass response.

In some embodiments, the second path includes a resonant circuitconfigured to provide the band-stop response.

In some embodiments, the resonant circuit includes an LC resonantcircuit.

In some embodiments, the resonant circuit includes a SAW (surfaceacoustic wave) resonant circuit.

In some embodiments, the multiplexer is a diplexer.

In some embodiments, the multiplexer further includes a third pathhaving an output coupled to the common path such that an RF signal inthe third path is combined with the RF signals in the first and secondpaths and routed through the common path, the third path configured toprovide a band-pass response for another frequency band BY.

In some embodiments, the multiplexer is a triplexer.

In some embodiments, the other frequency band BY is covered by thewideband response of the common path.

In some embodiments, the third path includes a band-pass filterconfigured to provide the band-pass response for the frequency band BY.

In some embodiments, the second path includes a resonant circuitconfigured to provide the band-stop response.

In some embodiments, the resonant circuit includes an LC resonantcircuit.

In some embodiments, the LC resonant circuit is configured to provide aplurality of stop-band responses.

In some embodiments, the LC resonant circuit includes one or moreswitchable capacitances.

In some embodiments, the resonant circuit includes a SAW (surfaceacoustic wave) resonant circuit.

In some embodiments, the SAW resonant circuit includes a first andsecond SAW elements arranged in series, the first SAW element configuredto provide the stop-band response for the frequency band BX, and thesecond SAW element configured to provide the stop-band response for thefrequency band BY.

In some embodiments, the SAW resonant circuit is substantially free ofswitches.

In some implementations, the present disclosure relates to a method formultiplexing radio-frequency (RF) signals. The method includes providinga common path to receive a plurality of RF signals. The method alsoincludes processing a first RF signal through a first path such that theprocessed first RF signal is routed to the common path, the processingof the first RF signal including band-passing the first RF signal for afrequency band BX. The method further includes processing a second RFsignal through a second path such that the processed second signal isrouted to the common path, the processing of the second RF signalincluding band-stopping the second RF signal for the frequency band BXsuch that the common path includes a wideband response that includes thefrequency band BX and one or more other frequency bands.

In some implementations, the present disclosure relates to aradio-frequency (RF) module. The RF module includes a packagingsubstrate configured to receive a plurality of components. The RF modulealso includes a multiplexer implemented on or within the packagingsubstrate, the multiplexer including a common path configured to receivea plurality of RF signals, the multiplexer further including a firstpath having an output coupled to the common path and configured toprovide a band-pass response for a frequency band BX, the multiplexerfurther including a second path having an output coupled to the commonpath such that RF signals in the first and second paths are combined androuted through the common path, the second path configured to provide aband-stop response for the frequency band BX such that the common pathincludes a wideband response that includes the frequency band BX and oneor more other frequency bands.

In some embodiments, the first path includes a band-pass filterconfigured to provide the band-pass response.

In some embodiments, the second path includes a resonant circuitconfigured to provide the band-stop response.

In some embodiments, the RF module further includes a low-noiseamplifier (LNA) implemented in each of the first and second paths.

In some embodiments, the LNAs are implemented upstream of the band-passfilter and the resonant circuit.

In some embodiments, the RF module is a front-end module.

In some embodiments, the RF module is a diversity receive (DRx) module.

In some implementations, the present disclosure relates to a wirelessdevice. The wireless device includes a receiver configured to processradio-frequency (RF) signals. The wireless device also includes an RFmodule in communication with the receiver, the RF module including amultiplexer having a common path configured to receive a plurality of RFsignals, the multiplexer further including a first path having an outputcoupled to the common path and configured to provide a band-passresponse for a frequency band BX, the multiplexer further including asecond path having an output coupled to the common path such that RFsignals in the first and second paths are combined and routed throughthe common path, the second path configured to provide a band-stopresponse for the frequency band BX such that the common path includes awideband response that includes the frequency band BX and one or moreother frequency bands. The wireless device further includes an antennain communication with the RF module, the antenna configured to receivethe RF signals.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a block diagram of a multiplexer, in accordance with someembodiments of the present disclosure.

FIGS. 2A-2C show block diagrams of multiplexers, in accordance with someembodiments of the present disclosure.

FIGS. 3A-3C show examples related to a diplexer configured to combinenarrowband signals, in accordance with some embodiments of the presentdisclosure.

FIG. 4 shows a block diagram of a multiplexer, in accordance with someembodiments of the present disclosure.

FIG. 5 shows an example of a wideband response, in accordance with someembodiments of the present disclosure.

FIG. 6 shows a block diagram of a diplexer, in accordance with someembodiments of the present disclosure.

FIG. 7 shows a block diagram of a diplexer, in accordance with someembodiments of the present disclosure.

FIG. 8 shows a block diagram of a diplexer, in accordance with someembodiments of the present disclosure.

FIG. 9 shows example frequency ranges, in accordance with someembodiments of the present disclosure.

FIG. 10 shows example S-parameters, in accordance with some embodimentsof the present disclosure.

FIG. 11 shows a block diagram of diplexer, in accordance with someembodiments of the present disclosure.

FIG. 12 shows insertion loss, return loss, and isolation plots, inaccordance with some embodiments of the present disclosure.

FIG. 13 shows a block diagram of triplexer, in accordance with someembodiments of the present disclosure.

FIG. 14 shows a block diagram of triplexer, in accordance with someembodiments of the present disclosure.

FIG. 15 shows a block diagram of triplexer, in accordance with someembodiments of the present disclosure.

FIG. 16 shows a block diagram of triplexer, in accordance with someembodiments of the present disclosure.

FIG. 17 shows a block diagram of triplexer, in accordance with someembodiments of the present disclosure.

FIG. 18 shows various response plots, in accordance with someembodiments of the present disclosure.

FIG. 19 shows a block diagram of a triplexer, in accordance with someembodiments of the present disclosure.

FIG. 20 shows various response plots, in accordance with someembodiments of the present disclosure.

FIG. 21 shows a block diagram of a triplexer, in accordance with someembodiments of the present disclosure.

FIG. 22 shows various response plots, in accordance with someembodiments of the present disclosure.

FIG. 23 shows a block diagram of a triplexer, in accordance with someembodiments of the present disclosure.

FIG. 24 shows a block diagram of a SAW resonant circuit, in accordancewith some embodiments of the present disclosure.

FIG. 25 shows various performance plots, in accordance with someembodiments of the present disclosure.

FIG. 26 shows a block diagram of a module, in accordance with someembodiments of the present disclosure.

FIG. 27 shows a block diagram of an example wireless device, inaccordance with some embodiments of the present disclosure.

FIG. 28 shows a block diagram of an example wireless device, inaccordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

FIG. 1 shows a block diagram of a multiplexer 100 that can include oneor more features as described herein. In some embodiments, such amultiplexer can be configured for radio-frequency (RF) applications.

Referring to FIG. 1, the multiplexer 100 can be configured to combine aplurality of signal paths, including those associated with a firstsignal RF_(i) and a second signal RF_(j), into a common path RF_OUT. Forthe purpose of description, a signal path and a corresponding signal maybe used interchangeably. For example, RF_(i) may be used to refer to thefirst signal and/or to the path associated with that signal, dependingon context.

It will be understood that while various examples are described hereinin the context of signal paths being combined into a common path, one ormore features of the present disclosure can be implemented in a reversedconfiguration. For example, a common RF signal can be split into aplurality of signals, and such a configuration can benefit from one ormore features as described herein.

For the purpose of description, it will be understood that multiplexeror multiplexing can involve combining of two or more signal paths into acommon signal path. For example, FIG. 2A shows that a multiplexer can bea diplexer 100 configured to combine two signal paths RF1, RF2 into acommon signal path RF_OUT. FIG. 2B shows that a multiplexer can be atriplexer 100 configured to combine three signal paths RF1, RF2, RF3into a common signal path RF_OUT. FIG. 2C shows that a multiplexer canbe a quadplexer 100 configured to combine four signal paths RF1, RF2,RF3, RF4 into a common signal path RF_OUT. Other numbers of signal pathscan be configured into a common signal path.

FIGS. 3A-3C show examples related to a diplexer 10 configured to combinetwo narrowband signals. As shown in FIG. 3A, such a diplexer can beutilized in a carrier-aggregation (CA) configuration 12 in which RFsignals associated with two example bands (Band A and Band B) can becombined into a common path RF_OUT for CA operation. In the exampleshown, the Band A signal provided to the diplexer 10 is shown to beoutput from a first low-noise amplifier (LNA) 21, and the Band B signalprovided to the diplexer 10 is shown to be output from a second LNA 23.The first and second LNAs 21, 23 are shown to receive and amplifysignals from their respective band-pass filters (depicted as an assembly14). The band-pass filters 14 are shown to receive signals split from acommon input RF_IN.

Referring to FIG. 3A, the diplexer 10 is shown to include a firstband-pass filter 22 configured to filter the amplified signal outputfrom the first LNA 21, and a second band-pass filter 24 configured tofilter the amplified signal output from the second LNA 23. The filteredsignals from the first and second band-pass filters 22, 24 are shown tobe combined into a common output RF_OUT.

In the example of FIG. 3A, the A-band and B-band can be nearby frequencybands suitable for CA operations. Examples of such frequency bands aredescribed herein in greater detail. Use of the band-pass filters 22, 24configured for such frequency bands results in a frequency responsedepicted in FIG. 3B, in which two narrow passbands are located near eachother. Accordingly, use of the diplexer 10 is generally limited to suchfrequency bands.

FIG. 3C shows a more general representation of the example diplexer 10of FIG. 3A. In FIG. 3C, a diplexer 10 is shown to include a first signalconditioning circuit 22 (such as a band-pass filter) that yields anarrowband output signal, and a second signal conditioning circuit 24(such as a band-pass filter) that yields another narrowband outputsignal. Accordingly, the combined output of the diplexer 10 includes acombination of two narrow bands that are sufficiently separated (e.g.,sufficiently separated for CA operations).

Described herein are examples related to multiplexers such as diplexersand triplexers that are capable of providing a wideband capability. Asalso described are examples to demonstrate that such widebandmultiplexers can be implemented while maintaining good performancelevels in other operating parameters.

FIG. 4 depicts a multiplexer 100 that can desirably provide widebandcapability. The multiplexer 100 can include a first signal conditioningcircuit 112 configured to substantially pass a given frequency band(Band X) so as to yield a frequency response indicated as 116 at itsoutput 114. The multiplexer 100 can further include a second signalconditioning circuit 122 configured to pass a range of frequency aboutBand X and larger than the width associated Band X, but not pass Band X.Accordingly, the signal conditioning circuit 122 and its correspondingfrequency response 126 at the output 124 is indicated as Band X.

In some embodiments, the first signal conditioning circuit 112 can be aband-pass filter configured to pass Band X, and the second signalconditioning circuit 122 can be a resonant circuit, such as a tankcircuit, tuned to substantially block Band X. Examples of such aresonant circuit are described herein in greater detail.

In some embodiments, the foregoing responses of the first and secondconditioning circuits 112, 122 can be expressed algebraically, in whichthe passage of Band X is represented as X, and the Band X response isrepresented as Wideband—X. Accordingly, when the output paths 114 and124 (and thus the corresponding frequency responses 116, 126) arecombined into a common path, the resulting frequency can be a widebandresponse (Wideband) with little or no dip in amplitude at or near BandX.

FIG. 5 depicts an example of such a wideband response that can beobtained relative to Band X. It will be understood that Band X can belocated anywhere within the wideband range.

In some embodiments, Band X can be a narrowband. For the purpose ofdescription, such a narrowband can include a frequency range associatedwith a cellular band in some standard. Examples of such standardcellular bands are described herein in greater detail. It will beunderstood that such a narrowband can also include a frequency rangeassociated with a sub-band which is one of a plurality of frequencysegments of, for example, a cellular band.

For the purpose of description, a wideband can include a frequency rangethat includes the foregoing Band X, as well as one or more othernarrowbands. In some embodiments, such Band X and one or more othernarrowbands can be suitable for CA operations, including downlink CAoperations. Examples of such a wideband are described herein in greaterdetail.

FIGS. 6-25 show various examples related to multiplexers having, amongothers, the foregoing wideband capability. FIGS. 6-12 show examples inwhich multiplexers can be diplexers. FIG. 13-25 show examples in whichmultiplexers can be triplexers.

FIG. 6 shows an example of a diplexer 100 in which a first signalconditioning circuit can be a band-pass filter 112 configured forpassage of a given band (Band X, or BX), and a second signalconditioning circuit can be an LC resonant circuit configured forpassage of a wideband except BX. Similarly, FIG. 7 shows an example of adiplexer 100 in which a first signal conditioning circuit can be aband-pass filter 112 configured for passage of a given band (Band X, orBX), and a second signal conditioning circuit can be a SAW (surfaceacoustic wave) resonant circuit configured for passage of a widebandexcept BX.

Referring to FIGS. 6 and 7, the BX band-pass filter 112 is shown toreceive a signal through a BX path and output a filtered signal throughan output path 114. In some embodiments, such an output path can includea phase shifting circuit 140. Such a phase shifting circuit can beconfigured to allow the filtered output of the BX filter 112 and theoutput of the resonant circuit 122 to have appropriate phases relativeto each other to yield a wideband response when combined.

Referring to FIGS. 6 and 7, the resonant circuit 122 is shown to receivean input signal through a wideband path that can include a matchingcircuit 140. Such a matching circuit can be configured to, for example,provide impedance matching between the resonant circuit and an upstreamcomponent such as an LNA (not shown).

In the examples of FIGS. 6 and 7, it will be understood that the BX pathand the wideband path providing inputs to the diplexer 100 can becoupled to, for example, outputs of respective LNAs similar to thearrangement of LNAs in the example of FIG. 3A. For the purpose ofdescription, it will be understood that such LNAs and any other signalconditioning components upstream of the BX filter 112 and the resonantcircuit 122 to be configured so that signals being routed through the BXpath and the wideband path can include respective band(s). For example,an LNA upstream of the BX filter 112 can be configured to provide anoperating bandwidth that includes the BX band. Similarly, an LNAupstream of the resonant circuit 122 can be a broadband LNA configuredto operate in a frequency range that includes a wideband as describedherein.

Referring to FIGS. 6 and 7, the outputs of the BX filter 112 and theresonant circuit 122 are shown to be combined into a common output 130.As described herein, such a combined output can have a widebandfrequency response.

FIG. 8 shows an example diplexer 100 that can be a more specific exampleof FIG. 6, where the diplexer 100 includes a band-pass filter 122configured for B1 band operation, and an LC resonant circuit 122configured for B1 notch operation. As shown in FIG. 9, B1 band has afrequency range of 2.11 GHz to 2.17 GHz for receive (Rx) operation. Asalso shown in FIG. 9, B4 band (2.11 GHz-2.155 GHz for Rx) can be coveredsubstantially completely by B1 band. Accordingly, the B1 band may bereferred to as B1/B4 band, or even B4 band herein, unless distinctionbetween the two example bands are stated explicitly.

Referring to FIGS. 8 and 9, the B1 resonant circuit 122 can beconfigured to allow passage of one or more bands near B1 band (e.g., B3(1.805 GHz-1.88 GHz for Rx), B2 (1.93 GHz-1.99 GHz for Rx) and B30 (2.35GHz-2.36 GHz for Rx)), and substantially notch B1. Various examplesrelated to operating performance with respect to one or more of suchbands near B1 are described herein in greater detail.

In the example of FIG. 8, the LC resonant circuit 122 can include aparallel combination of an inductance L1 and a capacitance C1. Further,a phase shifting circuit 140 along the B1 output path 114 can include acapacitance C3 and an inductive coupling to ground of a node downstreamof C3, through an inductance L3. Further, an inductance L2 upstream ofthe B1 filter 112 and a capacitance C2 upstream of the LC resonantcircuit 122 can be configured to provide impedance matchingfunctionality for the B1 filter 112 and the LC resonant circuit 122,respectively.

Although not shown, a diplexer 100 having a B1 filter and acorresponding B1 resonant circuit can be implemented, similar to theexample of FIG. 8, where the B1 resonant circuit can utilize a SAWresonator. FIG. 10 shows example S-parameters associated with terminalsindicated in FIG. 8 as Term1, Term2 and Term3. Example values ofcapacitances and inductances listed in Table 1 were utilized to obtainsuch responses.

TABLE 1 Circuit element Approximate value L1 0.78 nH L2 1.00 nH L3 9.165nH C1 7.00 pF C2 4.00 pF C3 5.29 pFIn Table 1, L1 and C1 are for the LC resonant circuit 122 of FIG. 8. L2,L3, C2 and C3 are for both of the diplexers having B1 LC resonantcircuit 122 (FIG. 8) and B1 SAW resonant circuit (not shown).

In FIG. 10, curve B in the right panel represents an insertion loss plotat Term3 when the B1 resonant circuit is an LC resonant circuit (FIG.8), and curve A in the same panel represents an insertion loss plot atTerm3 when the B1 resonant circuit is a SAW resonant circuit.

Also referring to FIG. 10, curve B in the left panel represents aninsertion loss plot at Term2 when the B1 resonant circuit is an LCresonant circuit (FIG. 8), and curve A in the same panel represents aninsertion loss plot at Term2 when the B1 resonant circuit is a SAWresonant circuit.

Based on the foregoing examples of insertion loss plots, one can seethat the B1-filtered response (upper right panel) shows a well-definedband as expected. For the B1 resonant circuit response, one can see thatboth of the LC resonant circuit and the SAW resonant circuit displayexcellent passband property, at least between 1.850 GHz to 1.990 GHzwhich covers B3 and B2 bands.

In the example of FIG. 10, it is noted that the insertion loss for theB3 and B2 bands (left panel) ranges from about 0.5 dB to 1.3 dB for theLC resonant circuit, and about 0.3 dB to 0.9 dB for the SAW resonantcircuit. Insertion loss for the B1 band (right panel) ranges from about2.7 dB to 2.2 dB for the LC resonant circuit, and about 1.8 dB to 1.5 dBfor the SAW resonant circuit. Isolation of the B1 band is about 10 dB.

FIG. 11 shows an example diplexer 100 that can be a more specificexample of FIG. 6, where the diplexer 100 includes a band-pass filter122 configured for B30 band operation, and an LC resonant circuit 122configured for B30 notch operation. As shown in FIG. 9, B30 band has afrequency range of 2.305 GHz to 2.315 GHz for transmit (Tx) operation,and 2.350 GHz to 2.360 GHz for Rx operation.

Referring to FIGS. 11 and 9, the B30 resonant circuit 122 can beconfigured to allow passage of one or more bands near B30 band andsubstantially notch B30. In the example of FIG. 11, the LC resonantcircuit 122 can include a parallel combination of an inductance L1 and acapacitance C1. Further, a phase shifting circuit 140 along the B1output path 114 can include an inductive coupling to ground through aninductance L2.

Although not shown, a diplexer 100 having a B30 filter and acorresponding B30 resonant circuit can be implemented, similar to theexample of FIG. 11, where the B30 resonant circuit is a SAW resonantcircuit. FIG. 12 shows example S-parameters associated with terminalsindicated in FIG. 11 as Term1, Term2 and Term3. Example values ofcapacitance and inductances listed in Table 2 were utilized to obtainsuch responses.

TABLE 2 Circuit element Approximate value L1 0.65 nH L2 11.0 nH C1 6.98pF

In FIG. 12, the right panel shows insertion loss, return loss andisolation plots at Term1. The left panel shows insertion loss, returnloss and isolation plots at Term3. One can see that the in-bandperformance parameters of the B30-filtered signal are similarlyacceptable as in the example of FIG. 10. Similarly, the performanceparameters of the lower bands passed by the B30 LC resonant circuit arealso acceptable as in the example of FIG. 10.

FIG. 13-25 show examples in which multiplexers can be triplexers. FIG.13 shows that a triplexer 100 can include three signal paths, with twobeing configured to pass first and second bands BX1, BX2, and the thirdbeing configured to stop either or both of BX1 and BX2. In the exampleshown in FIG. 13, the first signal path is shown to include a firstcircuit 112 a configured to pass the first band BX1, and the secondsignal path is shown to include a second circuit 112 b configured topass the second band BX2. The third path is shown to include a circuit122 configured to substantially stop either or both of BX1 and BX2.Output paths 114 a, 114 b, 124 corresponding to the circuits 114 a, 114b, 124 are shown to be combined into a common path 130. Examples relatedto the circuits 114 a, 114 b, 124 are described herein in greaterdetail.

As described herein, a circuit 122 configured to stop a band can beimplemented as an LC resonant circuit or a SAW resonant circuit.Accordingly, the circuit 122 of FIG. 13 can be implemented as an LCresonant circuit 122 (FIG. 14) or as a SAW resonant circuit (FIG. 15).

FIGS. 16-22 show examples related to a triplexer 100 having an LCresonant circuit 122 configured to stop either or both of B1 and B30bands that are being filtered through respective B1 and B30 band-passfilters 112 a, 112 b. The B1-filtered signal is shown to be provided toan output path 114 a through a capacitance C5, and the B30-filteredsignal is shown to be provided to an output path 114 b. The LC resonantcircuit 122 is shown to output its signal to an output path 124. Theoutput paths 114 a, 114 b, 124 are shown to be combined to a common path130. A node corresponding to the common path 130 is shown to be coupledto ground through an inductance L2. Although the examples are describedin the context of B1 and B30 being the filtered bands, it will beunderstood that one or more features of the present disclosure can alsobe utilized for other combinations of frequency bands.

The LC resonant circuit 122 can be configured to provide stoppingfunctionality for different bands by including adjustability of eitheror both of inductance and capacitance within the resonant circuit. Forexample, the B1/B30 LC resonant circuit 122 of FIG. 16 can include aparallel combination of L1 and C1, and a third parallel path with aswitchable (with switch S1) capacitance C2. With such a configuration,C1 can be selected to provide B1 resonance functionality (e.g., when S1is closed). When S1 is open, the combination of C1 and C2 (e.g., C1+C2when in parallel) can allow the resonant circuit 122 to provide B30resonance functionality.

An input path for such an adjustable resonant circuit can include anadjustable matching circuit 140. For example, two parallel paths eachwith a switchable capacitance can be provided. In some embodiments,either or both of the adjustable resonant circuit and the adjustablematching circuit can include programmable capacitance functionalityutilizing, for example, a switched capacitor array. The first path caninclude a capacitance C3 in series with a switch S2, and the second pathcan include a capacitance C4 in series with a switch S3. Accordingly, anumber of overall capacitance values can be provided for the matchingcircuit 140, including C3, C4 and C3+C4.

It will be understood that other configurations utilizing differentcombinations of inductance(s) and/or capacitance(s) can be implementedfor the resonant circuit 122 and/or the matching circuit 140.

In the example of FIG. 16, values of capacitances and inductances listedin Table 3 can be implemented.

TABLE 3 Circuit element Approximate value L1 0.70 nH L2 3.60 nH C1 6.50pF C2 1.40 pF C3 3.00 pF C4 0.15 pF C5 9.10 pF

FIG. 17 shows an example where the LC resonant circuit 122 of thetriplexer 100 and the matching circuit 140 are configured to provide B1resonance functionality. Thus, switch S1 of the LC resonant circuit 122is closed, and switches S2, S3 of the matching circuit 140 are closedand open, respectively.

FIG. 18 shows various response plots resulting from the exampleconfiguration of FIG. 17. The upper panel shows insertion loss plots atTerm7 and at Term8. The lower panel shows isolation loss plots at Term7and at Term8.

FIG. 19 shows an example where the LC resonant circuit 122 of thetriplexer 100 and the matching circuit 140 are configured to provide B30resonance functionality. Thus, switch S1 of the LC resonant circuit 122is open, and switches S2, S3 of the matching circuit 140 are open andclosed, respectively.

FIG. 20 shows various response plots resulting from the exampleconfiguration of FIG. 19. The upper panel shows insertion loss plots atTerm7 and at Term5. The lower panel shows isolation loss plots at Term7and at Term5.

FIG. 21 shows an example where the LC resonant circuit 122 of thetriplexer 100 is in the same configuration as in FIG. 19, but thematching circuit 140 configuration is different. More particularly,switches S2, S3 of the matching circuit 140 are closed and open,respectively.

FIG. 22 shows various response plots resulting from the exampleconfiguration of FIG. 21. The upper panel shows insertion loss plots atTerm5 and at Term8. The lower panel shows isolation loss plots at Term5and at Term8.

In the examples related to FIGS. 16-22, a given resonant circuit can bereconfigured to provide resonance functionality for different bands.FIGS. 23-25 show that in some embodiments, a triplexer 100 can include aresonant circuit assembly 122 having a plurality of resonant circuitsarranged in series. For example, a B1 SAW resonant circuit 122 a and aB30 SAW resonant circuit 122 b can be arranged in series to operate withcorresponding band-pass filters for the B1 and B30 bands. Such anin-series arrangement of resonant circuits can provide, for example,band-stop functionalities for B1 and B30 bands that are being passedthrough their respective band-pass filters. It will be understood thatsuch in-series assembly of resonant circuits may also be implementedwith LC resonant circuits.

In the example of FIG. 23, the arrangement of the B1 and B30 filters 112a, 112 b relative to their output paths 114 a, 114 b and the output path124 of the resonant circuit assembly 122 can be similar to the exampleof FIG. 16. In the example of FIG. 23, a matching circuit 140 is shownto include an inductance L1, and a node associated with the common path130 is shown to be coupled to ground through an inductance L2.

FIG. 24 shows an example of how each SAW resonant circuit (122 a or 122b) can be modeled. Such a model can include a series arrangement of aninductance L10 and a capacitance C10, and such a series-arrangement isshown to be arranged in parallel with a capacitance C11. The foregoingcombination of C10, L10 and C11 is shown to be in series with aresistance R10. Values associated with such circuit elements can beselected to allow modeling of, for example B1 and B30 resonancefunctionalities.

FIG. 25 shows various performance plots associated with the example ofFIGS. 23 and 24. For example, isolation plots at Term4, at Term3, and atTerm1 are shown.

It is noted that in the example of FIGS. 23-25, a single state of thetriplexer 100 can cover substantially all modes associated with itswideband functionality.

FIG. 26 shows that in some embodiments, a multiplexer having one or morefeatures as described herein can be implemented in a module 300. Such amodule can include a packaging substrate 302 such as a laminatesubstrate or a ceramic substrate. The module 300 can include one or moreLNAs 304 implemented on the packaging substrate 302. The module 300 canfurther include a multiplexer 100 having one or more features asdescribed herein. Such a multiplexer can be configured to combine aplurality of signal path into a common path with wideband capability.

In some implementations, an architecture, device and/or circuit havingone or more features described herein can be included in an RF devicesuch as a wireless device. Such an architecture, device and/or circuitcan be implemented directly in the wireless device, in one or moremodular forms as described herein, or in some combination thereof. Insome embodiments, such a wireless device can include, for example, acellular phone, a smart-phone, a hand-held wireless device with orwithout phone functionality, a wireless tablet, a wireless router, awireless access point, a wireless base station, etc. Although describedin the context of wireless devices, it will be understood that one ormore features of the present disclosure can also be implemented in otherRF systems such as base stations.

FIG. 27 depicts an example wireless device 400 having one or moreadvantageous features described herein. In some embodiments, suchadvantageous features can be implemented in a front-end (FE) module oran LNA module 300. In some embodiments, such a module can include moreor less components than as indicated by the dashed box.

PAs in a PA module 412 can receive their respective RF signals from atransceiver 410 that can be configured and operated to generate RFsignals to be amplified and transmitted, and to process receivedsignals. The transceiver 410 is shown to interact with a basebandsub-system 408 that is configured to provide conversion between dataand/or voice signals suitable for a user and RF signals suitable for thetransceiver 410. The transceiver 410 is also shown to be connected to apower management component 406 that is configured to manage power forthe operation of the wireless device 400. Such power management can alsocontrol operations of the baseband sub-system 408 and other componentsof the wireless device 400.

The baseband sub-system 408 is shown to be connected to a user interface402 to facilitate various input and output of voice and/or data providedto and received from the user. The baseband sub-system 408 can also beconnected to a memory 404 that is configured to store data and/orinstructions to facilitate the operation of the wireless device, and/orto provide storage of information for the user.

In the example wireless device 400, the module 300 can include amultiplexer 100 configured to provide one or more functionalities asdescribed herein. Such a multiplexer can facilitate processing ofsignals received through an antenna 420 and an antenna switch module(ASM) 414. Amplified and multiplexed signals from the multiplexer 100are shown to be routed to the transceiver 410.

FIG. 28 shows another example of a wireless device 500 in which one ormore features of the present disclosure can be implemented in adiversity receive (DRx) module 300. In such a wireless device,components such as user interface 502, memory 504, power management 506,baseband sub-system 508, transceiver 510, power amplifier (PA) 512,antenna switch module (ASM) 514, and antenna 520 can be generallysimilar to the examples of FIG. 27.

In some embodiments, the DRx module 300 can be implemented between oneor more diversity antennas and the ASM 514. Such a configuration canallow an RF signal received through the diversity antenna 530 to beprocessed (in some embodiments, including amplification by an LNA) withlittle or no loss of and/or little or no addition of noise to the RFsignal from the diversity antenna 530. Such processed signal from theDRx module 300 can then be routed to the ASM through one or more signalpaths 532 which can be relatively lossy.

In the example of FIG. 28, the RF signal from the DRx module 300 can berouted through the ASM 514 to the transceiver 510 through one or morereceive (Rx) paths. Some or all of such Rx paths can include theirrespective LNA(s). In some embodiments, the RF signal from the DRxmodule 300 may or may not be further amplified with such LNA(s).

A number of other wireless device configurations can utilize one or morefeatures described herein. For example, a wireless device does not needto be a multi-band device. In another example, a wireless device caninclude additional antennas such as diversity antenna, and additionalconnectivity features such as Wi-Fi, Bluetooth, and GPS.

One or more features of the present disclosure can be implemented withvarious cellular frequency bands as described herein. Examples of suchbands are listed in Table 4. It will be understood that at least some ofthe bands can be divided into sub-bands. It will also be understood thatone or more features of the present disclosure can be implemented withfrequency ranges that do not have designations such as the examples ofTable 4.

TABLE 4 Band Mode Tx Frequency Range (MHz) Rx Frequency Range (MHz) B1FDD 1,920-1,980 2,110-2,170 B2 FDD 1,850-1,910 1,930-1,990 B3 FDD1,710-1,785 1,805-1,880 B4 FDD 1,710-1,755 2,110-2,155 B5 FDD 824-849869-894 B6 FDD 830-840 875-885 B7 FDD 2,500-2,570 2,620-2,690 B8 FDD880-915 925-960 B9 FDD 1,749.9-1,784.9 1,844.9-1,879.9 B10 FDD1,710-1,770 2,110-2,170 B11 FDD 1,427.9-1,447.9 1,475.9-1,495.9 B12 FDD699-716 729-746 B13 FDD 777-787 746-756 B14 FDD 788-798 758-768 B15 FDD1,900-1,920 2,600-2,620 B16 FDD 2,010-2,025 2,585-2,600 B17 FDD 704-716734-746 B18 FDD 815-830 860-875 B19 FDD 830-845 875-890 B20 FDD 832-862791-821 B21 FDD 1,447.9-1,462.9 1,495.9-1,510.9 B22 FDD 3,410-3,4903,510-3,590 B23 FDD 2,000-2,020 2,180-2,200 B24 FDD 1,626.5-1,660.51,525-1,559 B25 FDD 1,850-1,915 1,930-1,995 B26 FDD 814-849 859-894 B27FDD 807-824 852-869 B28 FDD 703-748 758-803 B29 FDD N/A 716-728 B30 FDD2,305-2,315 2,350-2,360 B31 FDD 452.5-457.5 462.5-467.5 B33 TDD1,900-1,920 1,900-1,920 B34 TDD 2,010-2,025 2,010-2,025 B35 TDD1,850-1,910 1,850-1,910 B36 TDD 1,930-1,990 1,930-1,990 B37 TDD1,910-1,930 1,910-1,930 B38 TDD 2,570-2,620 2,570-2,620 B39 TDD1,880-1,920 1,880-1,920 B40 TDD 2,300-2,400 2,300-2,400 B41 TDD2,496-2,690 2,496-2,690 B42 TDD 3,400-3,600 3,400-3,600 B43 TDD3,600-3,800 3,600-3,800 B44 TDD 703-803 703-803

In various examples described herein, circuit elements such ascapacitance, inductance and resistance can be utilized. It will beunderstood that such circuit elements can be implemented as a devicessuch as capacitors, inductors and resistors. Such devices can beimplemented as discrete devices and/or distributed devices.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description using thesingular or plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

1. A multiplexer for processing of radio-frequency (RF) signals, themultiplexer comprising: a common path configured to receive a pluralityof RF signals; a first path having an output coupled to the common pathand configured to provide a band-pass response for a frequency band BX;and a second path having an output coupled to the common path such thatRF signals in the first and second paths are combined and routed throughthe common path, the second path configured to provide a band-stopresponse for the frequency band BX such that the common path includes awideband response that includes the frequency band BX and one or moreother frequency bands.
 2. The multiplexer of claim 1 wherein the firstpath includes a band-pass filter configured to provide the band-passresponse.
 3. The multiplexer of claim 1 wherein the second path includesa resonant circuit configured to provide the band-stop response.
 4. Themultiplexer of claim 3 wherein the resonant circuit includes an LCresonant circuit.
 5. The multiplexer of claim 3 wherein the resonantcircuit includes a SAW (surface acoustic wave) resonant circuit.
 6. Themultiplexer of claim 1 wherein the multiplexer is a diplexer.
 7. Themultiplexer of claim 1 further comprising a third path having an outputcoupled to the common path such that an RF signal in the third path iscombined with the RF signals in the first and second paths and routedthrough the common path, the third path configured to provide aband-pass response for another frequency band BY.
 8. The multiplexer ofclaim 7 wherein the multiplexer is a triplexer.
 9. The multiplexer ofclaim 7 wherein the other frequency band BY is covered by the widebandresponse of the common path.
 10. The multiplexer of claim 9 wherein thethird path includes a band-pass filter configured to provide theband-pass response for the frequency band BY.
 11. The multiplexer ofclaim 7 wherein the second path includes a resonant circuit configuredto provide the band-stop response.
 12. The multiplexer of claim 11wherein the resonant circuit includes an LC resonant circuit.
 13. Themultiplexer of claim 12 wherein the LC resonant circuit is configured toprovide a plurality of stop-band responses.
 14. The multiplexer of claim13 wherein the LC resonant circuit includes one or more switchablecapacitances.
 15. The multiplexer of claim 11 wherein the resonantcircuit includes a SAW (surface acoustic wave) resonant circuit.
 16. Themultiplexer of claim 15 wherein the SAW resonant circuit includes afirst and second SAW elements arranged in series, the first SAW elementconfigured to provide the stop-band response for the frequency band BX,and the second SAW element configured to provide the stop-band responsefor the frequency band BY.
 17. The multiplexer of claim 16 wherein theSAW resonant circuit is substantially free of switches.
 18. (canceled)19. A radio-frequency (RF) module comprising: a packaging substrateconfigured to receive a plurality of components; and a multiplexerimplemented on or within the packaging substrate, the multiplexerincluding a common path configured to receive a plurality of RF signals,the multiplexer further including a first path having an output coupledto the common path and configured to provide a band-pass response for afrequency band BX, the multiplexer further including a second pathhaving an output coupled to the common path such that RF signals in thefirst and second paths are combined and routed through the common path,the second path configured to provide a band-stop response for thefrequency band BX such that the common path includes a wideband responsethat includes the frequency band BX and one or more other frequencybands.
 20. The RF module of claim 19 wherein the first path includes aband-pass filter configured to provide the band-pass response.
 21. TheRF module of claim 20 wherein the second path includes a resonantcircuit configured to provide the band-stop response. 22-26. (canceled)